Cov kev xav tau rau cov khoom sib txuas hauv cov xov tooj ntawm tes muaj xws li miniaturization, nto-mount peev xwm, standardization thiab modularity, multi-functional interfaces, yooj yim ntawm kev khiav hauj lwm, siab -ceev kis tau tus mob thiab electromagnetic compatibility, thiab txhawb kom muaj peev xwm cia.
Cov khoom sib txuas hauv cov xov tooj ntawm tes feem ntau yog siv hauv cov ntu hauv qab no: ① SIM (Subscriber Identity Module) daim npav txuas; ② LCD (Liquid Crystal Display) connectors; ③ Keypad connectors; ④ I/O (Input/Output) interface connectors; ⑤ Roj teeb connectors; ⑥ Board- mus rau -board connectors; thiab ⑦ Lwm tus. Cov khoom siv xov tooj ntawm tes txuas feem ntau tau muab faib ua tsib hom loj: FPC connectors, I / O connectors, card connectors, roj teeb connectors, thiab kav hlau txais xov connectors.
Txhawm rau ua kom haum rau kev lag luam kev lag luam mus rau nyias, sib dua, thiab siab dua - cov xov tooj ntawm tes ua tau zoo, cov qauv tsim txuas txuas ntxiv mus rau qhov loj dua me me, slimness, thiab txhim kho kev ua tau zoo. Cov qauv tshwj xeeb suav nrog: FPC connector pin pitches yog shrinking rau 0.3mm thiab txawm me dua; Board-rau-Board (BTB) connectors yuav tsum tau finer pin pitches (piv txwv li, 0.35mm) thiab qis profiles (xws li, 0.9mm), thaum tseem yuav tsum tau shielding peev xwm; thiab daim npav connectors tau siv zog rau ultra{11}}thin profiles (piv txwv li, 0.50mm) thiab ntau-kev sib koom ua ke (xws li, 2-hauv-1 connectors combining SIM thiab T-Flash card slots). Qhov kev thov rau siab -kev sib kis ceev- tau tsav los ntawm cov thev naus laus zis xws li 5G- tau txhawb nqa qhov xav tau ntawm LCP / MPI cov ntaub ntawv thiab RF BTB connectors kom ruaj ntseg ntawm high-frequency, high-ceev teeb liab kis tau tus mob.
